1V to 16V, Single-Channel, Hot-Swap Controllers
with Precision Current-Sensing Output
An output resistor, R CSOUT , must be connected between
the transconductance current-sense amplifier output
(d = t SU /(t SU + t RETRY )). Calculate the required transient
thermal resistance with the following equation:
CSOUT and AGND. The transconductance G M , of the
amplifier is typically 2500 F S:
R CSOUT × G M × V SENSE, FS ≤ 2.5V
Z θ JA(MAX) ≤
T JMAX × T A
V IN × I INRUSH
n-Channel MOSFET Selection
Select the external n-channel MOSFET according to the
application’s current level. The MOSFET’s on-resistance
(R DS(ON) ) should be chosen low enough to have a mini-
mum voltage drop at full load to limit the MOSFET power
dissipation. High R DS(ON) causes output ripple if there
is a pulsating load. Determine the device power rating to
accommodate a short-circuit condition on the board at
startup and when the device is in automatic-retry mode
(see the MOSFET Thermal Considerations section).
The MAX5977A’s fault latch allows the use of MOSFETs
with lower power ratings. A MOSFET typically withstands
single-shot pulses with higher dissipation than the speci-
fied package rating.
MOSFET Thermal Considerations
During normal operation, the external MOSFETs dis-
sipate little power. The MOSFET R DS(ON) is low when
the MOSFET is fully enhanced. The power dissipated in
normal operation is P D = I LOAD 2 x R DS(ON). The most
power dissipation occurs during the turn-on and turn-off
Layout Considerations
To take full advantage of the switch response time to an
output fault condition, it is important to keep all traces
as short as possible and to maximize the high-current
trace dimensions to reduce the effect of undesirable
parasitic resistance and inductance. Place the devices
close to the card’s connector, and a 0.01 F F capacitor to
GND should be placed as close as possible to V IN . Use
a ground plane to minimize impedance and inductance.
Minimize the current-sense resistor trace length and
ensure accurate current sensing with Kelvin connec-
tions.
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads to
the ground plane through vias, and use enlarged copper
mounting pads on the top side of the board.
transients when the MOSFETs are in their linear regions.
Take into consideration the worst-case scenario of a
continuous short-circuit fault; consider these two cases:
1) The single turn-on with the device latched after a fault
(MAX5977A).
2) The continuous automatic retry after a fault
(MAX5977B).
MOSFET manufacturers typically include the package
thermal resistance from junction to ambient (R B JA ) and
thermal resistance from junction to case (R B JC ), which
determine the startup time and the retry duty cycle
PART
MAX5970
MAX5978
Related Parts
DESCRIPTION
0 to 16V, Dual Hot-Swap Controller with
a 10-Bit Current and Voltage Monitor and
Four LED Drivers
0 to 16V, Single Hot-Swap Controller with
a 10-Bit Current and Voltage Monitor Plus
Four LED Drivers
11
相关PDF资料
MAX5980EVKIT# EVAL KIT MAX5980
MAX5982CEVKIT# EVAL KIT MAX5982C
MAX6397SATA+T IC SW OVERVOLT PROT 8-TDFN
MAX6496EVKIT+ KIT EVAL FOR MAX6496
MAX6651EVKIT EVAL KIT FOR MAX6651
MAX7325EVKIT+ KIT EVAL FOR MAX7325
MAX7326EVKIT+ KIT EVAL FOR MAX7326
MAX7359EVKIT+ KIT EVAL FOR MAX7359
相关代理商/技术参数
MAX5977AEVKIT+ 功能描述:热插拔功率分布 1V to 16V Hotswap Controller with Precision Current Sensing Output RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube
MAX5977BETP+ 功能描述:热插拔功率分布 1-16V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube
MAX5977BETP+T 功能描述:热插拔功率分布 1-16V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube
MAX5977ETP+ 制造商:Maxim Integrated Products 功能描述:- Rail/Tube
MAX5978ETJ+ 功能描述:热插拔功率分布 0-16V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube
MAX5978ETJ+T 功能描述:热插拔功率分布 0-16V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube
MAX5980EVKIT# 功能描述:电源开关 IC - POE / LAN MAX5980 Eval Kit RoHS:否 制造商:Fairchild Semiconductor 开关数量:Single 开关配置:SPST 开启电阻(最大值):7.3 Ohms 串话: 带宽: 开启时间(最大值):13 ns 关闭时间(最大值):20 ns 切换电压(最大): 工作电源电压:8 V to 26 V 最大工作温度:+ 125 C 安装风格:Through Hole 封装 / 箱体:TO-220F-6
MAX5980EVKIT+ 功能描述:电源开关 IC - POE / LAN RoHS:否 制造商:Fairchild Semiconductor 开关数量:Single 开关配置:SPST 开启电阻(最大值):7.3 Ohms 串话: 带宽: 开启时间(最大值):13 ns 关闭时间(最大值):20 ns 切换电压(最大): 工作电源电压:8 V to 26 V 最大工作温度:+ 125 C 安装风格:Through Hole 封装 / 箱体:TO-220F-6